A new thin film head generation IC head

In order to achieve a breakthrough in advanced head fabrication cost and performance, a new type of thin-film head on silicon (IC head) for high-density magnetic recording was developed. This technology is based on the intensive use of semiconductor equipment and silicon material. The authors discuss the fabrication cost, head structure, and design and compare them with those of conventional thin-film heads made on ceramic substrates. Fabrication processes and technical details for realizing heads and sliders in the same process line by techniques similar to those used by semiconductor manufacturers are given. It is concluded that the IC head offers many advantages over the conventional thin-film head due to its mass production and low fabrication cost. >