Spraying head heating and cooling device and method for plasma reaction device

The invention discloses a spraying head heating and cooling device and method for a plasma reaction device. A spraying head structure, a heating structure and a cooling structure are used for building the spraying head heating and cooling device. By combining the parts, reaction gas can be fully mixed and pre-heated in the spraying head structure, the heating structure and the cooling structure before entering a plasma reaction cavity, temperature reduction can be constantly performed on the heating structure according to a temperature, detected in real time, of the heating structure and the cooling structure during the chip etching process in the plasma reaction cavity, so that the temperature of the reaction gas is enabled not to be changed, and the etching efficiency and the product quality are improved.