Effect of TT-LYK as the Inhibitor on Step Height Reduction for Copper CMP

The effect of TT-LYK (C 12 H 18 N 4 O 2 ) on step height reduction in a glycine-based weakly alkaline slurry during the copper chemical mechanical planarization (CMP) process was discussed. The corrosion inhibitor in the slurry could balance the over etching to realize the global planarization of the copper layers. The experimental results verified TT-LYK was indeed effective in inhibiting copper corrosion. The corrosion and passivation mechanism was also discussed. SEM and XPS test results confirmed that TT-LYK will adsorb on the surface of the metal to form a passivation film. It has significant reference worth in the following further development of copper CMP slurry.