surfactants conditional inhibitors for the electrolytic deposition of copper on a surface

Electrolytes for the electrolytic deposition of copper comprising as an inhibitor, a salt of poly (alkylene-biguanide) Inhibition developed by poly salts (alkylene biguanide) is conditioned by the concentration of an accelerator to the surface of copper.The surfactant character salts of poly (alkylene-biguanide) to transfer them instantly interface electrolyte- air interface electrolyte- copper when contacting the cathode and the electrolyte electrolyte.Les according to the invention are suitable for obtaining smooth and glossy electroplating and to deposit copper on surfaces having concavities submicron useful in microelectronics.