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Acemap > Paper > The Effect of Bi/Sn Ratio of Bi–Sn–Ag Solder on the Mechanical and Electrical Properties of Interfaces Between Solder/Thermoelectric Material and Solder/Electrode

The Effect of Bi/Sn Ratio of Bi–Sn–Ag Solder on the Mechanical and Electrical Properties of Interfaces Between Solder/Thermoelectric Material and Solder/Electrode

2015 
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