13.3: Improvement in Temperature Durability of Bendable Electronic Paper Using Cholesteric Liquid Crystals ChLC

2011 
Liquid crystal elements used to bond upper and lower substrates with adhesive column spacers, and thus prevent cell gap variations when bent, had problems with the spacers peeling at high temperatures and with the ChLC elements foaming at low temperatures. We developed a new flexible type of e-paper that does not have problems of foaming or peeling in a temperature range of −15 to 70°C, by forming spacers with an extremely high coefficient of thermal expansion and suitable disposition rates.
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