Barrier-Layer Optimization for Enhanced GaN-on-Diamond Device Cooling

GaN-on-diamond device cooling can be enhanced by reducing the effective thermal boundary resistance (TBReff) of the GaN/diamond interface. The thermal properties of this interface and of the polycrystalline diamond grown onto GaN using SiN and AlN barrier layers, as well as without any barrier layer under different growth conditions are investigated and systematically compared for the first time. TBReff values are correlated with transmission electron microscopy analysis, showing that a lowest reported TBReff (~6.5 m2K/GW) is obtained by using ultrathin SiN barrier layers with a smooth interface formed, while direct growth of diamond onto GaN results in one to two orders of magnitude higher TBReff due to the formation of a rough interface. AlN barrier layers can produce a TBReff as low as SiN barrier layers in some cases; however its TBReff is rather dependent on growth conditions. We also observe a decreasing diamond thermal resistance with increasing growth temperature.