LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults

Due to the winding level of the thinned wafers and the surface roughness of silicon dies, the quality of through-silicon vias (TSVs) varies during the fabrication and bonding process. If one TSV exhibits a defect during its manufacturing process, the probability of multiple defects occurring in the TSVs neighboring the FTSV increases, i.e., the TSV defects tend to be clustered, which significantly reduces the yield of 3D-ICs. To resolve the clustered TSV faults, router-based, ring-based, group-based, and cellular-based RTSV architectures were proposed. However, the repair rate is low and the hardware overhead as well as delay overhead is high. In this paper, we propose a honeycomb-based RTSV architecture to utilize the area and delay more efficiently as well as to maintain high yield. The simulation results show that the proposed architecture has a 99.84% repair rate for uniform faults and an 81.42% repair rate for highly clustered faults. The proposed design achieves a 51.66% reduction of hardware overhead compared with the router-based design and a 20.69%, 46.93%, 34.17%, and 11.15% reduction of total delay compared with ring-based, router-based, group-based, and cellular-based methods, respectively.