Method for producing solder electrode, method for producing laminate, laminate and electronic component

The present invention is a method for producing a solder electrode, which comprises: a step (I) wherein a resist is formed on a substrate having an electrode pad from a coating film that is formed on the substrate by forming an opening in the coating film at a position corresponding to the electrode pad on the substrate; and a step (II) wherein the opening of the resist is filled with a molten solder. This method for producing a solder electrode is characterized in that: the resist is composed of at least two layers that contain a resin as a constituent; and a layer (1) of the resist, said layer being closest to the substrate, does not substantially contain a component that is self-crosslinkable by heat and a component that causes a resin, which is contained as a constituent in the layer (1), to be crosslinked by heat. According to this method for producing a solder electrode, a resist is less damaged and adhesion between a substrate and the resist is excellent even in cases where a method comprising a high-temperature processing is employed, so that an aimed solder electrode is able to be formed reliably. This method for producing a solder electrode can be effectively used for the formation of a bump by an IMS method, and the like.