Photosensitive resin composition, dry film of same, cured coating film of same, and printed wiring board using said cured coating film

Provided are: a photosensitive resin composition which has good sensitivity, good developability and excellent suppression of reflectance decrease of a cured product thereof caused by light irradiation or heat, while exhibiting excellent dry-to-touch properties, suppression of discoloration and dripping prevention effect; a dry film of this photosensitive resin composition; a cured coating film of this photosensitive resin composition; and a printed wiring board which uses this cured coating film. A photosensitive resin composition which contains (A) a carboxyl group-containing resin having a styrene skeleton, (B) a photopolymerization initiator and (C) an inorganic filler, and which is characterized in that (A) the carboxyl group-containing resin having a styrene skeleton has a weight average molecular weight of 10,000-50,000 and an acid value of 80-200 mgKOH/g.