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Effect of bonding pressure on the strength of Cu/Cu direct bonding by surface activated method
Effect of bonding pressure on the strength of Cu/Cu direct bonding by surface activated method
2014
Jun Utsumi
Yuko Ichiyanagi
Keywords:
Surface roughness
Anodic bonding
Analytical chemistry
Direct bonding
Metallurgy
Ultimate tensile strength
Composite material
Engineering
pressure sensitive
Correction
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