Outlook of device and assembly technologies enabling high-performance mobile computing: IRDS view (invited)

We are living in a connected world with access to data in vast amounts. This connectivity is enhanced by more intelligent sensors and human-computer interfaces bringing people closer to computation in a more natural and accessible way. Instant data generation requires ultra-low-power devices with an “always-on" feature at the same time with high-performance devices that can generate the data instantly. Big data requires abundant computing, communication bandwidth, and memory resources to generate services and sensible information that people need. But transfer of data becomes a limitation for the scaling of systems where both on-chip and off-chip interconnects become quite scarce in meeting this demand. In this paper we will present about these challenges, how they impact the outlook of More Moore technologies and 3D architectures in this interconnect-scarce era.