Copper-clad laminate using a copper foil and the copper foil with a carrier with a carrier

On the copper foil or copper alloy foil, roughening (Treat) roughened layer formed by treating the applied, heat-resistant layer made of Ni-Co layer formed on the roughened layer, and this Zn formed on the heat-resistant layer, Ni, having a plurality of surface treatment layer made of weathering layer and anticorrosive layer contains Cr, the total amount of Zn / (total Zn content of the surface treatment layer + all Ni the amount) is 0.02 or more 0.35 or less, the surface treatment layer copper foil, wherein the total Ni content of the surface treatment layer is 1600μg / dm After forming the roughening treatment on the surface of the copper foil, after forming the heat-resistant layer anti-corrosion layer thereon, the copper-clad laminate silane coupling treatment was used copper foil for printed circuit which has been subjected, fine pattern after printed circuit formed, when subjected to acid treatment or chemical etching of the substrate, can of improving the suppression of adhesion deterioration by penetration of the acid into the interface between the copper foil circuit and the substrate resin, excellent acid resistance adhesion strength and it provides excellent copper foil with carrier in the alkali etching properties.