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Crystal Defect Analysis of Latent Scratch Induced during CMP Process on 4H-SiC Wafer Using Electron Microscopy
Crystal Defect Analysis of Latent Scratch Induced during CMP Process on 4H-SiC Wafer Using Electron Microscopy
2018
Takahiro Sato
Hiroaki Matsumoto
Seiichi Suzuki
Toshiyuki Isshiki
Nakamura Kuniyasu
Keywords:
Composite material
Materials science
Focused ion beam
Electron microscope
Wafer
Scanning transmission electron microscopy
Scratch
elastic distortion
Correction
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