A new EMI-noise reduction method in LSI-Package-Board system

Electromagnetic Interference (EMI) becomes one of emerging issues for recent designs because LSI-Package-Board system is getting larger and more complicated. There are difficulties in simulating and understanding causes of EMI-noise. However there are few papers discussing simulation methods and root cause analyses for EMI-noise issues. This paper proposes a new efficient and quick method based on AC analysis for the EMI-noise root cause analysis, instead of transient analysis. Total simulation runtime of the proposed method is over 30 times shorter than a conventional one. We applied the proposed method to an industrial LSI-Package-Board system. Identifying which element induces EMI-noise at frequency ranges of concern, we have successfully reduced the EMI-noise.