Parameters on the fan out packaging heat dissipation performance impact study

Objective: The influence of packaging parameters on the heat dissipation performance of fan out packaging. Methods: The schematic diagram and multi package parameters of the device are designed to adjust the various cooling frequencies in the packaging process. The thermocouple is arranged to calculate the error of the thermal output pressure value, evenly distribute the monitoring points, obtain the average value of the detected data, and detect the balance temperature, the thermal output pressure value and the heat flow rate of the fan outlet package. The heat dissipation performance of fan out package under different encapsulation parameters is compared. Results: The first-level package parameter can balance the minimum time required for the temperature of the fan out package on both sides, the time needed to balance the temperature is relatively stable, and the heat output pressure value has a positive correlation with the pressure difference, which indicates that the heat dissipation capacity is strong. Second-level packaging parameters need to balance the temperature on both sides for a longer time as well as the third level package parameters do. The conclusion is that encapsulation parameters can promote the thermal performance of fan out package. Reasonable encapsulation parameters can improve the thermal dissipation performance of fan out package and have practical significance.