The method of making a solder, the joint structure and joint structure

2013 
The present invention discloses a solder joint structure and a method of manufacturing the contact structure. Solder comprises zinc-based metal layer, a copper metal film and the noble metal film. Copper metal film completely cover the surface of zinc-based metal layer, the noble metal film is a copper film is completely coated. Joint structure comprising a zinc-based metal and the intermetallic compound layer. Via the metal layer and the noble metal consisting of zinc, and the metal layer completely covers the dielectric surface of the zinc-based metal layers.
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    0
    References
    0
    Citations
    NaN
    KQI
    []