The method of making a solder, the joint structure and joint structure
2013
The present invention discloses a solder joint structure and a method of manufacturing the contact structure. Solder comprises zinc-based metal layer, a copper metal film and the noble metal film. Copper metal film completely cover the surface of zinc-based metal layer, the noble metal film is a copper film is completely coated. Joint structure comprising a zinc-based metal and the intermetallic compound layer. Via the metal layer and the noble metal consisting of zinc, and the metal layer completely covers the dielectric surface of the zinc-based metal layers.
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