Old Web
English
Sign In
Acemap
>
Paper
>
Migration of Copper through Tungsten-Filled Via on Single Damascene Copper Interconnect
Migration of Copper through Tungsten-Filled Via on Single Damascene Copper Interconnect
2010
Byungkook Kim
Jong-sam Kim
B. M. Seo
Jonghoon Oh
Joo-Hwan Cho
J.-Y. Lee
Kwon Hong
Byeongchan Choi
Sung Kye Park
Keywords:
Nanotechnology
Tungsten
Metallurgy
Copper
Copper interconnect
Materials science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
1
Citations
NaN
KQI
[]