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Failure and Stress Analysis of Cu TSVs using GHz-Scanning Acoustic Microscopy and Scanning Infrared Polariscopy
Failure and Stress Analysis of Cu TSVs using GHz-Scanning Acoustic Microscopy and Scanning Infrared Polariscopy
2015
Ingrid De Wolf
Ahmad Khaled
Martin Herms
Matthias Wagner
Tatjana Djuric
Peter Czurratis
Sebastian Brand
Keywords:
Optoelectronics
Infrared
Materials science
Scanning Acoustic Microscopy
Analytical chemistry
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