Monolithically fabricated polymermems 3-axis thermal accelerometers designed for automated wirebonder assembly

This paper reports on two novel 3-axis thermal accelerometers based on different mechanical structures that are fabricated using polyimide PI-2611, and assembled using a standard wire-bonder. One accelerometer design has an un-amplified linear DC sensitivity of plusmn45 muV/g, plusmn60 muV/g, and plusmn35 muV/g on the X, Y, and Z axes respectively. The second design has a sensitivity of plusmn17 muV/g, plusmn8.5 muV/g, and plusmn14 muV/g respectively. Both accelerometers are assembled by applying a lateral push to each of the out-of-plane parts using an unmodified wire-bonder. This paper will detail the fabrication, design, assembly, and functional results of the two 3-axis thermal accelerometer designs.