Application of cylindrical, triangular and hemispherical dimples in the film cooling technology

The results of film cooling numerical simulation over a flat plate with coolant supply through a single span-wise array of inclined (α = 30°) holes arranged inside cylindrical, triangular, and hemispherical dimples are represented in the paper. Such configurations are of a great practical interest for application in advanced blade cooling systems of high-performance gas turbines. The schemes with coolant supply into triangular and hemispherical dimples were first proposed and patented by the IET of the NAS of Ukraine. For numerical simulation the ANSYS CFX 14 commercial code was used. Numerical simulation were carried out in a wide range of the blowing ratio parameter varied from 0.5 to 2.0. For low blowing ratio parameter (m = 0.5) the laterally averaged film cooling efficiency is actually the same for all investigated schemes over the main film cooling area. In this area, the most simple in terms of the film cooling production technology configuration can be used. At the medium and high blowing ratios (m = 1.0 or higher) all investigated film cooling schemes allow to increase the laterally averaged film cooling efficiency in comparison with the traditional cooling scheme with single row of incline holes. In this case the configuration with coolant supply into triangular dimples of the «crater» type demonstrates the best film cooling efficiency due to significant reduction in the intensity and scale of the "kidney" vortex beyond configuration, as well as due to decrease in the coolant blowing non-uniformity factor.