Development of Cu/Cu interconnections using an indium interlayer

A new technology for fabrication of joints based on the principle of isothermal solidification is presented. Diffusion soldering has a relatively low cost since a small amout of material is used and a small energy consumption is involved due to the low fabrication temperature. This preliminary study contributes to the search of new alternatives technically and economically viable to replace the use of aggressive materials for the environment such as lead as solder material and fluxes and solvent constituted by CFC. Indium as joint material is used to interconnect Cu pieces. The features of the intermetallics formed make possible the fabrication of thermally and mechanically stable bonds.