Adhensive composition for semiconductor device and multi-layer adhensive film consisting of the same

The present invention through the combination and that, in order to solve the transition metal and transition reliability deterioration of the semiconductor chip which is caused due to the movement of the metal ions, transition metal ions on the multi-layer structure the adhesive film prepared using the adhesive composition and this semiconductor or transition metal ions and oxidizing or reducing to, but using an adhesive composition comprising a functional group that can significantly reduce the mobility of the transition metal, and further an adhesive film that is capable of taking into consideration the subsequent wire bonding process to ensure the fluidity formation Thereby, it is possible to increase the reliability of the semiconductor operation, to and at the same time ensuring the dimensional stability of the adhesive film, increasing the tensile strength relates to the invention to increase the reliability of a semiconductor chip bonding process. Adhesive film, the semiconductor adhesive composition, dicing, a transition metal for