Silicon based LED microdisplays: the experience of design and manufacturing
2007
Design and manufacturing process of a full color LED microdislay fabricated by standard CMOS technology and
containing an array of aluminum/nanostructured porous silicon reverse biased light emitting Schottky diodes is
discussed. Being ofa solid state construction, these microdisplays are cost-effective, thin and light in weight due to very
simple device architecture. Its benefits include also super high resolution, wide viewing angles, fast response time and
wide operating temperature range. The advantages of full integration of an LED-array and driving circuitry onto a Sichip
is also discussed.
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