Silicon based LED microdisplays: the experience of design and manufacturing

2007 
Design and manufacturing process of a full color LED microdislay fabricated by standard CMOS technology and containing an array of aluminum/nanostructured porous silicon reverse biased light emitting Schottky diodes is discussed. Being ofa solid state construction, these microdisplays are cost-effective, thin and light in weight due to very simple device architecture. Its benefits include also super high resolution, wide viewing angles, fast response time and wide operating temperature range. The advantages of full integration of an LED-array and driving circuitry onto a Sichip is also discussed.
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