Forming an integrated chip system and method

Embodiment of a method for forming a semiconductor package comprising: a first die attached to the first carrier; depositing a first spacer material around the first die; and after deposition of the first spacer material, engaging the second die to the first die. Engaging the second die to the first die includes forming a dielectric - dielectric engagement. The method further comprises removing the first carrier and the fan-out is formed redistribution layer (RDL) on a second side opposite the first die die. Fan-out RDL electrically connected to the first die and the second die. Embodiments of the present invention further provides a semiconductor package.