One kind of Sn-Sb-X-based high-temperature lead-free solder

The present invention relates to an Sn-Sb-X-based high-temperature lead-free solder, the solder alloy composition by weight of Sb: 6 ~ 20%, X is a combination of one or more transition metals, a weight percent : 0.1 to 3.0%, the balance being Sn. X may be a combination of one or more of Ni, Mn, Co, Fe and other transition metals. The present invention is Sn-Sb-X-based high-temperature lead-free solders may further include one more of the total element content of microalloying elements Ag, Cu, La, Ce or the like microalloyed should not exceed 1.0%. Close to the melting point of the solder of the present invention had a higher content of a high-temperature lead solder, and low cost, good mechanical properties, good wettability, it is possible to form a good solder joint, which can be used in place of high-lead solder.