Heat-conductive sealing member and electronic device sealed by means of same

Disclosed is a heat-conductive sealing member that has exceptionally high moisture barrier properties and also has heat dissipation properties. The heat-conductive sealing member is characterized by being provided with a metal substrate, an insulation layer that is formed upon the abovementioned metal substrate and comprises a resin with thermal conductivity, and a removed section of insulation layer that is a section in which the abovementioned insulation layer has not been formed upon the abovementioned metal substrate and that has been formed in a manner so as to surround the center of the abovementioned insulation layer.