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Simulation Studies on Fluorine Spec Limit for Process Monitoring of Microchip Al Bondpads in Wafer Fabrication
Simulation Studies on Fluorine Spec Limit for Process Monitoring of Microchip Al Bondpads in Wafer Fabrication
2013
Younan Hua
Nistala Ramesh Rao
Yanjing Yang
S. P. Zhao
Redkar Shailesh
Keywords:
Spec#
Optoelectronics
Wafer fabrication
Materials science
Fluorine
Correction
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