Process for the structuring and show chip singulation

A method for patterning a substrate and a structured substrate are disclosed. In one embodiment, a method comprises: providing a substrate having a first major surface and a second major surface, wherein the substrate is fixed to a support arrangement on the second main surface; Make a photolithography step on the first major surface of the substrate to mark a plurality of locations on the first major surface, wherein the plurality of locations corresponding to future Perforationsstrukturen and future incision areas for a plurality of future individual semiconductor chips to be obtained from the substrate; and plasma etching the substrate at the plurality of locations until the carrier assembly is achieved, whereby the Perforationsstrukturen are generated within the plurality of individual semiconductor chips and simultaneously separating the individual semiconductor chips along the incision areas