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Low Temperature Bonding with Thin Wafers for 3D Integration
Low Temperature Bonding with Thin Wafers for 3D Integration
2011
Thorsten Matthias
Bioh Kim
Paul Kettner
Markus Wimplinger
Paul Lindner
Keywords:
Anodic bonding
Wafer
Materials science
Composite material
Optoelectronics
Correction
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