Effects of nanoparticles on properties and interface reaction of Sn solder for microelectronic packaging
2020
In this study, the effects of Cu nanoparticles on the melting characteristics, wettability, interfacial reaction and mechanical properties of Sn–xCu (x = 0, 0.3, 0.7, 1.0, 1.5, 2.0) composite solde...
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