Magnetron sputtering apparatus

The invention discloses magnetron sputtering equipment. The magnetron sputtering equipment comprises a vacuum chamber wall, a connecting shaft, a workbench and an electric conduction electrode, wherein the vacuum chamber wall surrounds a vacuum chamber; one end of the connecting shaft is connected to the vacuum chamber wall, the workbench is arranged in the vacuum chamber and is arranged on the other end of the connecting shaft, and the workbench is used for fixing a substrate; the electric conduction electrode is arranged on the vacuum chamber wall in a penetrating manner, one end of the electric conduction electrode is connected with the workbench, the workbench is electrically connected with an external power source through the electric conduction electrode, and the external power source applies high potential on the workbench through the electric conduction electrode. The magnetron sputtering equipment provided by the invention has the advantages that the workbench and the substrate are protected by the high potential, electrification positive ions flying to the substrate is influenced by electric field acting force in the opposite direction, the quantity and energy of electrification positive particles are greatly reduced, the bombardment of the surface of the substrate caused by the electrification positive particles is reduced, the sediment deposited on the surface of the substrate is protected, the surface of the sediment is smooth, and the quality of a crystal is good.