The temperature dependence of resistivity and solidifying process of Al63Cu27Sn10 alloy

Abstract Liquid structure of alloys has a remarkable influence on the microstructure and mechanical properties of solidifying alloy. Resistivity, as one of the sensitive physical properties to microstructure and macrostructure, plays a very important role in the research of liquid structure and can reflect the electronic transport properties. In this paper, the liquid structure and electronic transport properties of Al 63 Cu 27 Sn 10 alloy have been investigated to explore its liquid phase separation and solidification process. In the heating and cooling process, there is good superposition and consistency of the ρ - T curves and DSC curves, which verifies the accuracy of resistivity method. The results show that monotectic reaction occurs at 575 °C, and the range of the immiscible area is from 530 °C to 635 °C for Al 63 Cu 27 Sn 10 alloy. Under conventional casting condition, the microstructure of Al 63 Cu 27 Sn 10 immiscible alloy melt and the solidifying process were discussed by differential scanning calorimetry (DSC), thermal analysis method (TAM), X-ray diffraction (XRD), scanning electron microscopy (SEM). The results show that: Al 63 Cu 27 Sn 10 alloy dose occur liquid phase separation at the range from 530 °C to 635 °C, and the small volume phase rich Sn droplets tends to gather to the middle to form the core-shell structure.