Thermosetting resin composition, the material and film substrate board

Mechanical properties, not only it can provide a molded article having excellent dimensional stability and heat resistance, provides a thermosetting resin composition capable of retaining Fugata shape well even after cured before curing . Comprising 100 parts by weight of a thermosetting resin and an inorganic compound 1-100 parts by weight dispersed in the thermosetting resin, the shape dispersion particle diameter of the inorganic compound is at 2μm or less, which is Fugata before curing but the thermosetting resin composition, which is held 75% or more after curing, as well as the substrate material and film substrate which is formed by using a thermosetting resin composition.