Mold circuit module and manufacturing method thereof

To provide a technique for preventing the detachment of the shield layer in the mold circuit module having a metal shield layer covering the surface of the resin layer containing a filler. In producing a mold circuit module, first, each substrate (100) an electronic component (200), covered with a first resin containing a filler (400). Then the surface of the first resin (400) covered with a second resin containing no filler (500). Thereafter, by performing the processes at half cut, formed from to expose the ground electrode within the substrate (100) (110), electroless plating shield layer covering the entire surface (600) of the substrate (100) . Then perform full-cut, to obtain a large number of mold circuit module.