Old Web
English
Sign In
Acemap
>
Paper
>
Evaluation of SCM Specifications in SCM/NAND Flash Hybrid SSD with Through-Silicon Via
Evaluation of SCM Specifications in SCM/NAND Flash Hybrid SSD with Through-Silicon Via
2018
Atsuya Suzuki
Yusuke Sugiyama
Chihiro Matsui
Ken Takeuchi
Keywords:
Through-silicon via
NAND gate
Electronic engineering
Materials science
Embedded system
Computer science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]