Plasma-enhanced Si-SiC low-temperature bonding based on graphene composite slurry interlayer

Abstract Recently, silicon carbide (SiC) has replaced silicon (Si) as a potential material for next-generation power devices. In this study, a Si-SiC low-temperature bonding method based on graphene composite slurry as an interlayer was developed. Ar plasma was used to treat the surfaces of Si and SiC to improve surface hydrophilicity for higher strength bonding. With the increase of discharge power, the root-mean -square (RMS) surface roughness of Si and SiC has obviously increased and the bonding quality was also greatly improved. For 70 W discharge power, the RMS surface roughness values of Si and SiC were 3.22 nm and 1.67 nm respectively, and the bonding strength reached approximately 10 MPa . Through SEM interface analysis, it can be found that a seamless bonding interface was obtained using this bonding process.