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Selective and Anisotropic Copper Electroplating Using Copper Overburden with an Inhibiting Additive
Selective and Anisotropic Copper Electroplating Using Copper Overburden with an Inhibiting Additive
2010
Toshio Haba
Hitoshi Suzuki
Hiroshi Yoshida
Haruo Akahoshi
Akira Chinda
Keywords:
Inorganic chemistry
Copper
Overburden
Anisotropy
Materials science
Metallurgy
Copper plating
Correction
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