Structure transformation and transformation method for coating machine manipulator suitable for warped wafer

The invention discloses a structure transformation and a transformation method for a coating machine manipulator suitable for a warped wafer. The structure transformation comprises a coating machine body and a manipulator for grabbing the wafer, wherein the manipulator comprises a locating plate and two side arms; the locating plate is detachably fixed on the coating machine; the two side arms are symmetrically arranged at two sides of the locating plate and are located at the positions on the edge of the wafer; the two side arms are combined with the locating plate to form a fork; and a plurality of suction nozzles for adsorbing the wafer are fixedly arranged on the side arms. According to the transformation method, a wafer taking position of the coating machine manipulator is transformed into a relatively light warped edge position of the wafer, so that the adsorption area is reduced; the wafer is relatively easily absorbed; and meanwhile, the adsorption mode for the wafer is transformed. In a form of the suction nozzles, by the characteristic that the suction nozzles can deform, the suction nozzles can be effectively attached to the back surface of the wafer, so that the vacuum suction target is achieved; the condition that the warped wafer is compatible with an unwarped wafer is achieved; and the structure transformation is flexible and convenient to use.