Electric component, structure for mounting the electric component, and method for mounting the electric component

Provided is an electric component wherein a good solder fillet can be formed, especially when a connecting terminal section is inserted into a through hole of a printed board and soldered by a reflow method, and high mounting reliability can be obtained.  A structure for mounting the electric component and a method for mounting the electric component are also provided. Connecting terminal sections (17, 18) which configure the rotating electric component has outer circumferential surfaces (17a, 18a), i.e., curved surfaces, formed by bending metal plates (3, 6).  Leading ends (17b, 18b) of the connecting terminal sections (17, 18) form a push-out section (37) which pushes out a cream solder applied in the through hole, and the leading ends function as a sucking section (38) for sucking the solder, which is molten by the heated outer circumferential surfaces (17a, 18a), into between the outer circumferential surfaces and the inner wall of the through hole.