Semiconductor element protection material and a semiconductor device

Excellent coating property, it is possible to obtain a cured product excellent in heat dissipation and flexibility, to provide a semiconductor element protection material capable of satisfactorily protecting the semiconductor element. Semiconductor element protection material according to the present invention, in order to protect the semiconductor element, said coating on the surface of the semiconductor element, a semiconductor element protection used to form a cured product on the surface of the semiconductor element is a material, is disposed between the semiconductor element and the other connection object member, different from the one forming the semiconductor element and the other of the cured product to adhere and fixed so as not to peel the connection object member, a flexible epoxy compound, and a different epoxy compounds and the flexible epoxy compound, a curing agent is liquid at 23 ° C., a curing accelerator, and a thermal conductivity of 10 W / m · K or more, and spherical and a certain inorganic filler.