Old Web
English
Sign In
Acemap
>
Paper
>
P1.6 - New Materials, Processes and design Methods for the Chip Mounting of High-Temperature Sensors
P1.6 - New Materials, Processes and design Methods for the Chip Mounting of High-Temperature Sensors
2017
M. Feißt
Nilavazhagan Subbiah
Roderich Zeiser
E. Möller
Jürgen Wilde
Keywords:
Design methods
Chip
Electronic engineering
Materials science
Computer science
new materials
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]