Copper paste composition for printing, and method of forming metal pattern using same

The present invention relates to a copper paste composition for printing, and a method of forming a metal pattern using same. In particular, the copper paste composition for printing according to the present invention can be subjected to both hot air drying and firing and can display favorable electrical conductivity because oxidation does not occur. The method of forming the metal pattern of the present invention employs a simple process of simultaneously drying and firing, so as to be usefully used in forming a metal pattern having favorable electrical conductivity.