Examination of Pb free soldier joints
2013
The European Union and Japan initiated the issue of RoHS, the directive about the
restriction of hazardous substances, which prohibits certain hazardous substances in electronic
equipment - including lead - application.
Due to the directive the use of lead free solder alloys is spreaded, however the Pb in the form of
contamination may be appear under technological process. The lead impurity has significant effect
on microstrucutre and lifetime so it is necessary to carry out detailed examinations.
In this paper the study of intermetallic compounds in six-element, Pb impured, thermal cycles testsubjected,
Sn-Ag-Cu (SAC) solder alloy is demonstrated.
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