Curable resin film, and first protective film forming sheet

This curable resin film is used for forming a first protective film on a bumpy surface of a semiconductor wafer by adhering and curing the curable resin film on said surface. A cured product of the curable resin film has a Young's modulus of 0.02 MPa or more, and a peak value of a load as measured in a probe tack test at 80°C of 500 g or less. This first protective film forming sheet is provided with a first support sheet, and the curable resin film is provided on one surface of the first support sheet.