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Development of Embedded Device Package, MCeP ® (Molded Core embedded Package)
Development of Embedded Device Package, MCeP ® (Molded Core embedded Package)
2017
Kouichi Tanaka
Yoshihiro Machida
Atsushi Nakamura
Masato Umehara
Tetsuya Koyama
Keywords:
Computer engineering
Chip-scale package
Electronic engineering
Embedded system
Engineering
Engineering drawing
Correction
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