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Semiconductor memery equipment

1994 
A semiconductor memory device in which a semiconductor chip is disposed on the inner leads by a plurality of leads of at least one layer of an insulating film, so that the inner leads and the semiconductor chip is electrically insulated. The semiconductor memory device comprising: a substantially symmetrically to the axis of the central portion of the semiconductor chip is sandwiched by a plurality of memory arrays are arranged at least two pads for the input and output data, and each of the inner lead and the pad connecting wire.
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