Semiconductor memery equipment
1994
A semiconductor memory device in which a semiconductor chip is disposed on the inner leads by a plurality of leads of at least one layer of an insulating film, so that the inner leads and the semiconductor chip is electrically insulated. The semiconductor memory device comprising: a substantially symmetrically to the axis of the central portion of the semiconductor chip is sandwiched by a plurality of memory arrays are arranged at least two pads for the input and output data, and each of the inner lead and the pad connecting wire.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI