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148 Effect of Thermal Cycling Interval on Thermal-migration Resistance of High Purity Aluminum Thin Film
148 Effect of Thermal Cycling Interval on Thermal-migration Resistance of High Purity Aluminum Thin Film
2010
Takahiro Sugano
Shien Ri
Masumi Saka
Mitsuo Yamashita
Fumiaki Togoh
Keywords:
Thermal
Thin film
Aluminium
Temperature cycling
Materials science
Metallurgy
aluminum thin film
Correction
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