Ultra-thin silicon-on-sapphire for flip-chip based CMOS/optoelectronic device integration
2001
We describe flip chip bonding of arrayed VCSELs and PIN detectors onto ultra-thin silicon-on-sapphire (UTSi). We present results of UTSi optical transmitters and receivers for 3.125 Gbps multimode parallel optical fiber links at 850 nm.
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