Semiconductor package, Method of fabricating the Semiconductor package, And Semiconductor module

The present invention provides a method for manufacturing a semiconductor package, a semiconductor module, and semiconductor package. The semiconductor package may include a substrate, a semiconductor chip, the connection terminals, molding the film, and a protective film. The protective film may cover the substrate, connection terminals, and the molded film. The protective film on the bottom of the connector is removed, the lower portion of the connection terminal can be exposed. The lower portion of the connection terminal to be connected to the module substrate, a semiconductor module can be produced. By the connector, the substrate, and the molded film is a protective film may not be exposed to the outside air or moisture.